Job Description
- Extensive experience in new looping development, NPI for complex structures, and advanced skills for maintaining high yield performance in mass production.
- Minimum 12 years of experience in wire bonding processes, focusing on semiconductor packaging, particularly memory ICs (eMMC, UFS, uMCP, LPDRAM, Flash IC). Experience with other package types (e.g., SCSP, CABGA, sMLF) is a plus.
- Proven expertise with advanced wire bonding equipment and techniques for fine pitch bonding, high-density packages, and multi-die structures.
Hands-on experience troubleshooting and maintaining wire bonding equipment (e.g., K&S).
4. Strong knowledge in process optimization, yield improvement, and loop shape control, including Ultra Low loop bonding, gold wire properties, and capillary design.
Familiarity with equipment setup, calibration, and maintenance, along with proficiency in analyzing defects (e.g., non-sticks, short loops) and implementing corrective actions.
Competence in DOE and FMEA methodologies.
Strong problem-solving skills, with a proactive approach to challenges.
Good communication skills, with the ability to collaborate cross-functionally and contribute to team harmony.
Ability to train and mentor junior engineers. Dispatch experience preferred.
Bachelor's degree in Engineering preferred; however, practical expertise and insight into process optimization are the key requirements.
Job Tags
Full time,